Advanced Millimeter-wave Technologies: Antennas, Packaging by Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher

By Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher

This e-book explains one of many preferred themes in instant and digital units neighborhood, specifically the instant verbal exchange at mmWave frequencies, specially on the 60 GHz ISM band.  It presents the reader with wisdom and methods for mmWave antenna layout, assessment, antenna and chip packaging. Addresses functional engineering concerns akin to RF fabric overview and choice, antenna and packaging standards, production tolerances, antenna and approach interconnections, and antenna one of many first books to debate the rising examine and alertness parts, relatively chip programs with built-in antennas, wafer scale mmWave phased arrays and imaging includes a strong variety of case reports to help realizing offers the antenna and packaging applied sciences for the newest and rising functions with the emphases on antenna integrations for sensible functions comparable to instant USB, instant video, section array, vehicle collision avoidance radar, and imaging 

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All three technologies have been MILLIMETER-WAVE PACKAGING 31 successfully applied to mmWave applications over many years. The primary selection criteria are material parameters such as low-loss, good thermal conductivity and precision. See also Chapter 4 for more details. 1 MCM-L The substrate is based on laminated multilayer PCB technology. It is an extension of COB, where the bare dies are mounted directly on a substrate. Multilayer structures are formed by etching patterns in copper foils laminated to both sides of a resin-based organic core.

Silicon-based antennas are discussed along with fundamental phased array architectures from RF, IF to LO. A candidate fully integrated mmWave silicon-based transceiver is presented with each block detailed and its performance summarized. Then a discussion of alternative methods ensues based upon direct antenna modulation for higher efficiency and security. It is presented in the context of a 60 GHz system with experimental results. 35 and 18 GHz along with experimental results. Chapter 15 extends the application space of mmWave to imaging, which among many other applications, expands our vision by letting us ‘see’ things under poor visibility conditions.

The first measurement technique allows measurement of the complex impedance and the antenna radiation pattern in an anechoic chamber. Finally, a novel non-destructive IC package characterization method is described that uses a recursive untermination method for non-destructive in-situ S-parameter measurements of multi-port packages. Chapter 18 extends the MEMS work started in Chapter 12, with a more detailed discussion on micromachining and silicon processing. It begins with a review of mmWave packaging technologies and introduces silicon based packaging through examples and applications highlighting advantages and disadvantages along the way.

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